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Material Dicing and Fabrication
Dicing is accomplished at the
Center using our Disco DAD321 Dicing
saw. Silicon, germanium, glass,
PCB board, and many other materials
can be diced. Circuit boards and structures can be fabricated at CHFE with
our etching facilities, LPKF Protomat milling machine, and UCLA machine shop
Dicing Rates:
Internal Users (University students and faculty): $160 saw rental + labor
+ cost of materials used
External Users (Industry and private ventures):
$320 saw rental + labor + cost of
materials used
General Fabrication Facilities:
Internal Users: $100/month
External Users: $100/use
LPKF Protomat Milling Machine:
Internal Users: $40 + materials +
labor
External Users: $80 + materials +
labor
Machine Shop Rates:
Internal Users: $49/hour
External Users: $98/hour
Labor Rates:
Internal Users: $30/hour
External Users: $60/hour
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