PCB Fabrication and Back-end Processing Posted on 08/21/201411/13/2024 by CHFE Intent to Use Form New user please fill out, print, and bring the PI signed form to the Center. You will also need to obtain a valid recharge ID PCB Fabrication and Back-end Processing Silicon, Ceramic, Glass, Sapphire, and many other materials can be diced using Disco DAD321 dicing saw. Wire bonder (TPT HB16) and wedge bonder (Westbond) are available for wedge/ball wire bonding (wire/ribbon, Al/Au). Dicing Rates:(No substrates with III-V toxic compounds) Internal Users (UCLA students and faculty): $160/job + labor $30/hour External Users (Industry and private ventures): $320/job + labor $60/hour General Fabrication Facilities: Internal Users: $100/month or $50/use External Users: $100/use LPKF Protomat Milling Machine: Internal Users: $40 + materials + labor External Users: $80 + materials + labor LPKF ProtoLaser U4: LPKF U4 Reservation Internal Users: $200 + materials + labor External Users: $400 + materials + labor Wirebonding Rate: Internal Users: $2/wire, $3/wire for under 10 wires External Users: $3/wire Labor Rates(Urgent job will add one hour labor): Internal Users: $30/hour External Users: $60/hour
