We offer a wide range of specialized testing equipment for rent
Silicon, Germanium, Glass, Sapphire, and many other materials can be diced. The fabrication facilities include a plotter for mask fabrication and a chemical etching station. In addition, the Center has an LPKF ProtoMat PCB milling machine.
We offer high precision wire bonding using TPT HB16 wire bonder.
The Center offers computer facilities for the design and simulation of structures and circuits.