Equipment Rental

We offer a wide range of specialized testing equipment for rent

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Material Dicing and Fabrication

Silicon, Germanium, Glass, Sapphire, and many other materials can be diced. The fabrication facilities include a plotter for mask fabrication and a chemical etching station. In addition, the Center has an LPKF ProtoMat PCB milling machine.

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Wire Bonding and PCB assembly

We offer high precision wire bonding using TPT HB16 wire bonder.

Computer Lab

The Center offers computer facilities for the design and simulation of structures and circuits.

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